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| HCNW3120-300E资料 | |
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HCNW3120-300E PDF Download |
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File Size : 116 KB
Manufacturer:AVAGO Description:the heat to be removed in all directions. Via holes, necessary for RF grounding, should be filled with copper plating to further remove heat from the duplexers Tx filter and dump it into a second ground plane located in a lower layer of the motherboard. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：HCNW3120-300E 厂 家：AVAGO 封 装： 批 号：0716 数 量：1328 说 明：Bid Price |
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运 费： 所在地： 新旧程度： |
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| 联系人：刘先生，罗小姐， |
| 电 话：0086-755-83576094, |
| 手 机：0086-(0)13728684091 |
| QQ：2355773149,2355773142,61991728 |
| MSN：franlmk168@live.cn |
| 传 真：86-755-83576061 |
| EMail：sales@xgf-ic.com, kupan_ic@126.com |
| 公司地址： 深圳市龙岗区龙城街道龙翔大道9009号珠江广场A2栋11F |
