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| HCPL063L-000E资料 | |
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HCPL063L-000E PDF Download |
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File Size : 116 KB
Manufacturer:AVAGO Description: 1. Thickness: 0.062 2. 3 x 3 3. 2 oz. Copper traces located on the top and bottom of the PCB for soldering 4. Copper areas located on the top and bottom of the PCB for soldering 5. Power and ground planes, 1 oz. copper (0.036 mm thick) 6. Thermal vias, 0.33 mm diameter, 1.5 mm pitch 7. Thermal isolation of power plane For more information, refer to TI technical brief SLMA002. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：HCPL063L-000E 厂 家：AVAGO 封 装： 批 号：0809 数 量：1942 说 明：Bid Price |
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运 费： 所在地： 新旧程度： |
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| 联系人：刘先生，罗小姐，刘小姐，刘先生，王先生 |
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