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| IRMCK201资料 | |
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IRMCK201 PDF Download |
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File Size : 116 KB
Manufacturer:IR Description:Epoxy die attach is recommended. The top and bottom metallization is gold. Conductive silver-filled epoxies are recommended. This method involves the use of epoxy to form a joint between the backside gold of the chip and the metallized area of the substrate. A 150 C cure for 1 hour is necessary. Recommended epoxy is Ablebond 84-1LMIT1 from Ablestik. |
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| 相关型号 | |
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| ◆ 48220-20629 | |
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| ◆ ATMEGA16A-AU | |
| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：IRMCK201 厂 家：IR 封 装： 批 号： 数 量：25 说 明：Bid Price |
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运 费： 所在地： 新旧程度： |
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| 联系人：刘先生，罗小姐，刘小姐，刘先生，王先生 |
| 电 话：0086-755-83576094,83576097,83576087,83576084,83979425 |
| 手 机：0086-(0)13728684091 |
| QQ：2355773149,2355773142,61991728 |
| MSN：franlmk168@live.cn |
| 传 真：86-755-83576061 |
| EMail：sales@xgf-ic.com, kupan_ic@126.com |
| 公司地址： 深圳市龙岗区龙岗街道龙岗大道远洋新干线晶钻广场2栋B座2915房 |
