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| PC111资料 | |
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PC111 PDF Download |
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File Size : 116 KB
Manufacturer:SHARP Description: The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. There- fore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. • The soldering temperature and time shall not exceed 260C for more than 10 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause exces- sive thermal shock and stress which can result in damage to the device. |
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| 1PCS | 100PCS | 1K | 10K | ||
| 价 格 | |||||
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型 号：PC111 厂 家：SHARP 封 装： 批 号：05h 数 量：457 说 明：Bid Price |
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运 费： 所在地： 新旧程度： |
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| 联系人：刘先生，罗小姐， |
| 电 话：0086-755-83576094, |
| 手 机：0086-(0)13728684091 |
| QQ：2355773149,2355773142,61991728 |
| MSN：franlmk168@live.cn |
| 传 真：86-755-83576061 |
| EMail：sales@xgf-ic.com, kupan_ic@126.com |
| 公司地址： 深圳市龙岗区龙城街道龙翔大道9009号珠江广场A2栋11F |
